Description
Ø 60/40 NO CLEAN WIRE Ø MELTING POINT:- 183 – 187ºC Ø SPECIFIC GRAVITY:- 8.20 Ø WORKING TEMP:- 350 – 380ºC Ø Flux Percentage 0.90-1.50 FOR No clean Ø FEATURE- Ø The flux used into the core of solder wire contains low hygroscopic resin and activator system is selected in such a way that there is no gradual deterioration of colour tone and similarly the scale of spattering is almost negligible. Ø Flux classified as no-clean is in accordance with the Spec.QQ-S-571F and passed all the tests of corrosion even the copper mirror test. Ø The which appears after soldering is highly transparent and as well as non-corrosive thus recommended not to wash even after soldering. Ø Capable of high-quality soldering on any electronic devices.
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